The system can accommodate a wide variety of substrate materials including silicon, ceramics, aluminae, copper, GaAs and other 3-5 compounds, polyimides, Kapton, stainless steel, glass, Mylar, and polyester.

The CHA Mark 50 Systems are available with a slide-out, load lock chamber designed to isolate the source(s) from the process chambers during operation. When equipped with this feature, the deposition system's process chamber can be independently pumped to high vacuum before exposing the source chamber to the process chamber. Pre-deposition processes, such as preheat, ion beam etch, and RF etch, can be performed in the process chamber while isolated from the source(s). This eliminates exposure of the source(s) to air, a major source of oxidation. This isolated chamber permits substrate loading and unloading while the deposition sources are maintained under high vacuum. Conversely, substrates can be independently held under vacuum to prevent oxidation if a source must be accessed in the middle of a run.

CHA's SR-Series Electron Beam Power Supplies feature superior emission current regulation, unique gun-programming capabilities, and durability. Models provide five different outputs-
3-4-6-10-15 KW. The output power may be used to supply a single EB Source, simultaneously power three sources in a single chamber, or independently operate a source in each of three chambers. Power supplies are also available for Sputtering, 1-3-5-15-30 KW; Heater, 6-10-16 KW; and Thermal deposition, 1-5-10 KW.

CHA's 4-, 6-, and 8-pocket Smart Source Electron Beam Guns are versatile and rugged enough for any job. Crucibles can be swapped in less than 30 minutes. A new interlocking lift-lid design prevents cross-contamination between pockets during deposition and raises so that material deposited on the gun is not swept into the other crucibles during turret rotation.
A complete range of Ion Beam Sources and CHA Sputtering Cathodes are also available