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The MPS-4 is designed for side sputtering operation with up to four DC or RF cathodes. The system features 360° substrate heating and rotating shutters for positive thickness cutoff control. Standard system fixturing consists of a dual drive planetary. The orbit drive allows substrates to pass through the deposition zone or to be stopped in front of or near any cathode while the substrate spins on it's own axis. | |
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| ©Copyright 2006 CHA Industries | ||