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The MPS-4 family incorporates a unique concept in small-to-large sputtering systems. Designed for applications ranging from commercial and laboratory research to volume production, the MPS-4 is an uncommonly flexible system offering a wide range of standard and optional features.

The MPS-4 is designed for side sputtering operation with up to four DC or RF round cathodes. System features 360-degree substrate heating and rotating shutters for predeposition and positive thickness cutoff control.

The MPS-4 family incorporates a horizontal-opening process chamber door. Substrates and fixturing are mounted on the door for easy substrate access in the clean room. The substrates are brought out of the machine into the clean room when the chamber door is opened.

Standard system fixturing consists of a dual drive planetary system. By use of two separately controlled drive motors, the rotation speed of the planets is independent of the orbit speed. The orbit drive motor allows a planet to be stopped in front of or near any cathode while the planet spins on its own axis.

The optional orbital speed controller may be programmed so all areas of the substrate are exposed to the deposition flux for identical time/rate periods.

The cathodes are accessed through the systems door. The compact chamber has only one major seal. The system utilizes 8-inch through 12-inch pumping stack components. A single rotating-plate substrate fixture is also available.

A built-in electronics rack assembly located in the upper and lower front panel contains all system controls. Customer has choice of computer or One-Button Automation control option.

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