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With lift-off lids the driving trend in multi-pocketed electron-beam guns, CHA developed their patent-pending SmartSource, a water-cooled, electron beam gun designed to raise PVD system performance and operator convenience. It features a unique lift-off, interlocking lid that guards against any cross-contamination of source materials between pockets, prevents debris from building up in the areas most prone to jamming, and keeps material from evaporating when the lid is raised and lowered.

Additional Features

- Lid can be manually lifted past 90 degrees to accommodate rapid refilling of crucible pockets or quick cleaning without any disassembly.
- Improved beam performance through the use of rare earth magnets and high nickel content pole pieces.
- An integral thermocouple allows for real time monitoring of the focus coil temperature.
- Source handles both turret rotation and lid actuation from a single input shaft.
- Both 4- and 6-pocket configurations are available, as well as bottom or side-drive configurations, making it an easy retrofit in all popular makes of high vacuum evaporation and deposition systems.

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CHA’s Dual Electron Beam Gun is ideal for versatile, even rugged applications from university and R&D to multilayer thin film processing, including GaAs devices to optical coating. Available in 4-, 6- and 8-pocket configurations, the EB Gun uses a permanent magnet with a superimposed field that is varied by applying current to electromagnetic coils that provide longitudinal and lateral sweep.

Additional Features

- easy crucible replacement
- compatibility with most popular power supplies
- interchangeable straps for top- or base-mounted configurations
- rugged construction
- fluid-cooled coils
- flared pockets to prevent jamming,
- heavy-duty terminal shield
- CAJON^® VCO waterline fittings.

A wide variety of pocket sizes are also available:

• 15cc, 25cc and 30cc for 4-pocket model
• 7cc or 15cc for 6-pocket model
• 7cc for 8-pocket model

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CHA’s thermal Fixed Resistance Sources are available in several designs and are compatible with most popular filaments, boats, crucibles, etc. Contact CHA for custom sources.

CHA’s unique thermal Swing Source is designed for use when deposition from the “centerline” of the chamber is desired, as in liftoff processing for minimizing angular incidence and coating of sidewalls. During the process, the Swing Source pivots into position on the centerline for deposition. The Swing Source is also desirable when more than one source is required.

CHA’s thermal Outrigger Source has a fixed mounting position that is adjacent to an EB gun.

CHA’s wire-fed Flashsource assembly is designed for flash evaporation of alloys and the deposition of pure metals such as silver, gold, copper and aluminum. Flash evaporation prevents the fractionation of the alloy such as what occurs during evaporation from a melt. The Flashsource accepts commercially available wire and boats, and can lower costs and maintenance by saving power and water consumption.

Additional Features

- reproducible alloy deposition from a single source
- no x-ray or radiation damage
- electronically isolated wire-fee to prevent current flow through the wire
- unit-block construction to simplify cleanup and assembly

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CHA’s Dual Electron Beam Gun combines with CHA’s unique thermal Swing Source for versatile, even rugged applications from university and R&D to multilayer thin film processing, including GaAs devices to optical coating. Available in 4-, 6- and 8-pocket configurations, the EB Gun uses a permanent magnet with a superimposed field that is varied by applying current to electromagnetic coils that provide longitudinal and lateral sweep. The Swing Source ensures deposition from the centerline of the chamber.