| The SSC-600 Sputtering System incorporates upper and lower base plates for sputter up or sputter down operation. Substrates and stations are accessible from the top or bottom of the process chamber. Lower baseplate swings out for access through cabinet doors. Upper baseplate is elevated for substrate access and may be rotated outward for station access.
The SSC-600 is provided with up to four DC or RF round cathodes. System features include a single plane, multi-substrate rotating fixture and a rotating shutter for predeposition and positive thickness cutoff control. The system utilizes 8-inch pumping stack components.
A built-in electronics rack assembly located alongside the chamber access doors contains all system controls. Customer has choice of computer or One Button Automatic control option. |
